VLSI Design 2010 VLSI Design 2010
VLSI Design 2010 VLSI Design 2010
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Schedule
Day 1 - Tuesday, January 5th, 2010
07:30 08:45 CONFERENCE REGISTRATION
08:45 09:30 Conference Inauguration by Dr. Biswadip Mitra, President, VSI and Managing Director, Texas Instruments India - Address by General Chairs and Program Chairs.
09:30 10:15 Technical Keynote 1 - Dimitri Antoniadis (MIT)
Chair: Niraj K. Jha, Princeton University
10:15 11:00 Technical Keynote 2 - Hermann Eul (Infineon)
Chair: Niraj K. Jha, Princeton University
11:00 11:30 Break
    Track A Track B Track C Ind. Forum
11:30 12:45 SessionA1: Clocking and Physical Design

Chair: Bharadwaj Amrutur, IISc Bangalore
Session B1: Application - specific Architectures

Chair: Debdeep Mukhopadhyay,
IIT Kharagpur.
Session C1:
High-speed Links


Chair: Pradip Thaker, Analog Devices.
 
11:30 11:55 A1.1: Analysis, Design and Simulation of Capacitive Load Balanced Rotary Oscillatory Array.

V.Honkote, B.Taskin, Drexel University
B1.1: Instruction Selection in ASIP Synthesis Using Functional Matching.

N.Arora, One97 Communications,
A.Kumar, IIT Delhi,K.Chandramohan, Synfora;
N. Pothineni, Google
C1.1: Channel Optimization for the Design of High Speed I/O links.

R. Mandrekar,
Y. Zhou, S. Chun,
A. Haridass, J. Choi, N. Na, D. Dreps,
R. Weekly, P. Harvey, IBM
Industry Forum Details
11:55 12:20 A1.2: An Alternative approach to Buffer Insertion for Delay and Power Reduction in VLSI Interconnects.

S. Saini, A. M. Kumar,
S. Veeramachaneni, IIIT Hyderabad;
M.B. Srinivas, BITS Hyderabad
B1.2: A 90mW / GFlop 3.4GHz Reconfigurable Fused/Continuous Multiply-Accumulator for Floating-point and Integer Operands in 65nm.

S.Jain, V.Erraguntla, S.Vangal, Y.Hoskote, N.Borkar, T.Mandepudi, Karthik V.P., Intel
C1.2: High Speed Serial Link Transmitter for 10Gig Ethernet Applications.

V.Muniyappa, N.Ramamoorthy, J.Reddy, IBM
Industry Forum Details
12:20 12:45 A1.3: A Graph-based I/O Pad Pre-placement Technique for Use with Analytic FPGA Placement Methods.

G.Grewal, M.Xu, University of Guelph, Ontario
B1.3: A Reconfigurable Architecture for Secure Multimedia Delivery.

A.Pande, J.Zambreno, Iowa State University, Ames
C1.3: Architectural Comparison of Analog and Digital Duty Cycle Corrector for High Speed I/O Link.

L. Raghavan, T. Wu, Rambus
Industry Forum Details
12:45 13:45 Lunch
13:45 14:30 Technical Keynote 3 - Larry Hornbeck (TI)
Chair: C. P. Ravikumar, Texas Instruments
14:35 15:50 Session A2:
Analog / RF CAD


Chair: Jaggy Rao, Texas Instruments.
Session B2: Efficient System Modeling and Design

Chair: Kanishka Lahiri, AMD.
Session C2:
Circuit Design and Modeling I


Chair: Kota Murali, IBM
 
14:35 15:00 A2.1: An Improvised MOS Transistor Model Suitable for Geometric Program based Analog Circuit Sizing in Sub-micron Technology.

S.DasGupta, P.Mandal, IIT Kharagpur
B2.1: Bottleneck Identification Techniques Leading to Simplified Performance Models for Efficient Design Space Exploration in VLSI Memory Systems.

G.Hazari, M.Desai, G.Srinivas, IIT Mumbai
C2.1: On Electrical Modeling of Imperfect Diffusion.

T.B.Chan, P.Gupta, University of California, Los Angeles
Industry Forum Details
15:00 15:25 A2.2: Towards Active-Passive Co-Synthesis of Multi-GigaHertz Radio Frequency Circuits.

R.Chakraborty, A.Sathanur, V.Jandhyala, University of Washington, Seattle
B2.2: Implementation of a Novel Phoneme Recognition System using TMS320C6713 DSP

J. Manikandan,
B. Venkataramani, M.Bhaskar, K. Ashish,
R. Raghul, V.Mathangi,
NIT Trichy
C2.2: An L-band Fractional-N Synthesizer with Noise-less Active Capacitor Scaling.

D.Sahu, S.Ganeshan, A.Lachhwani, R.Sachdev, Chandrashekar B.G, Texas Instruments
Industry Forum Details
15:25 15:50 A2.3: An Efficient Method for Bottom-Up Extraction of Analog Behavioral Model Parameters.

S.Pam, A.Bhattacharya, S.Mukhopadhyay, IIT Kharagpur
B2.3: Design of Low-Cost High-performance Floating-point Fused Multiply-Add with Reduced Power.

Z.Qi, Q.Guo, X.Li, G.Zhang, W.Hu. Chinese Academy of Sciences
C2.3: On-Chip Inductor-less DC-DC Boost Converter with Non-Overlapped Rotational-Interleaving Scheme.

T.Das, P.Mandal., IIT Kharagpur
Industry Forum Details
15:50 16:10 Break
16:10 16:55 Session A3: Tackling Process Variations

Chair: TBD
Session B3: Robust Design

Chair: M.Balakrishnan, IIT Delhi
Session C3: Chip 2020

Chair: Susmita Sur-Kolay, ISI Kolkata.
 
    A3.1 / ET1: Embedded Tutorial: Electrical Modeling of Imperfect Lithographic Patterning
T. B. Chen, R. Ghaida, P. Gupta, University of California, Los Angeles
B3.1 / ET2: Embedded Tutorial:: Robust System Design.
S. Mitra, Stanford University
C3.1 / ET3: Embedded Tutorial: Chip of 2020: Designing Low-Cost Energy-Efficient Complex Systems using Heterogeneous Components.
K. Roy, B.Jung, A.Raghunathan, Purdue University.
Industry Forum Details
17:00 18:00 Executive/CTO Panel:
“Is Open Source the Game Changer for Hardware Industry?”

Moderator: Raman Santhanakrishnan (LSI Logic)

Panelists: Guru Ganesan, ARM, Vikas Kohli, Cadence, Santosh Kumar, Texas Instruments
Prof. Rahul De, IIM Bangalore, TBD, Xilinx, Ulf Schneider, Lantiq India

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