THEME: Affordable Technology for Emerging Markets
This joint conference is a forum for researchers and designers to present and discuss various aspects of VLSI design, electronic design automation (EDA), enabling technologies, and embedded systems. It covers the entire spectrum of activities in the two vital areas of very large scale integration (VLSI) and embedded systems, which underpin the semiconductor industry. The five-day technical program will consist of three days of regular paper sessions, special sessions, embedded tutorials, industry presentation sessions, panel discussions, design contests and industrial exhibits, and two days of full-day tutorials.
Electronic systems are ubiquitous today in multiple applications, with emerging markets in health-care, entertainment and machine intelligence spurring several new ones. These markets often hinge delicately on the right blend of technology and affordability. Accordingly, the theme for this conference is set as “Affordable Technology for Emerging Markets”.
TOPICS: Papers are invited on topics related to (but not limited to) the following areas: |
| VLSI Design and Design Methodologies |
Embedded Systems |
Analog and RF mixed-signal design
CMOS sensors and MEMS
Design for manufacturability, reliability and yield
High-performance computing
Medical and automotive electronics
Mixed-signal design and technology CAD
Multi-core architectures
Nano-scale computing and nano-electronics
Networks-on-chip
Packaging and board design
Physical design
Power analysis and low-power design
Synthesis, DFT and test
Thermal analysis and temperature-aware design
Verification (simulation and formal) |
Audio, image and video processing
Case studies
ESL design flows
Embedded software tools
Emerging applications:
Health-care, imaging systems, entertainment,
sensor networks, ambient intelligence
Extensible, application-specific and reconfigurable
processing
FPGA/Emulation based design prototyping
Hardware/Software co-design
Performance analysis and profiling
Security and compression |
| Theme Based |
Automation needs to meet new product challenges
Concurrent engineering
Design and technology management
Economics of design and manufacturing
Emerging markets |
|
SUBMISSION GUIDELINES:
All submissions must be made at the conference web site.
Regular papers: The manuscript, to be prepared in IEEE two-column conference format and not to exceed six pages, must describe previously unpublished work, focusing on novel ideas, results and applications of the contribution. Submissions will undergo a BLIND review process, and papers disclosing the identity of the authors will be rejected
Embedded tutorials: Proposals in emerging areas of relevance to this conference can be submitted as two-page extended abstracts with details of topics covered. Accepted proposals will require full regular papers to be submitted.
Special sessions: Proposals on a specific subject must include a two-page summary, giving details of the set of related papers. Accepted proposals will require full regular papers to be submitted.
Panels: Proposals must be submitted together with details of the topics, their relevance and the conflicts they will address, together with names of panelists
All submissions of papers and proposals will imply that, if selected, the same must be presented at the conference in person. Hence, approvals from parent organizations must be obtained before the submissions are made.
TUTORIALS:
This conference has a history of running a highly successful tutorial program. Two days will be dedicated to full-day tutorials on important and emerging topics. Coordinating presenters are encouraged to submit proposals in the specified format giving adequate information on topics covered and details of other presenters.
EXHIBITS:
The conference provides a unique opportunity for vendors of VLSI design tools and services to display their products and services. Exhibition space is limited and those interested should contact the Exhibit Chair.
DESIGN CONTEST:
Please check the conference website or contact the Design Contest Chair for more information.
FELLOWSHIPS:
The Fellowship Chairs will award fellowships, based on need and merit, to partially cover the expenses of attendees from India. Candidates with accepted submissions will be given preference. |
