THEME: Embedded Solutions for Emerging Markets - Infrastructure, Energy, Automotive
This joint conference is a forum for researchers and designers to present and discuss various aspects of VLSI design, electronic design automation (EDA), embedded systems, and enabling technologies. It covers the entire spectrum of activities in the two vital areas of very large scale integration (VLSI) and embedded systems, which underpin the semiconductor industry. Two full days of tutorials will be followed by three days of regular paper sessions, special sessions, and embedded tutorials. Two workshops, RASDAT and SSD will be held on the 7th. Industry presentation sessions, panel discussions, design contests and industrial exhibits round off the program.
2011 marks the 10th edition of the conference on embedded systems, and a theme for the overall conference is “Embedded Solutions for Emerging Markets - Infrastructure, Energy, Automotive”.
TOPICS: Papers are invited on topics related to (but not limited to) the following areas:
VLSI Design and Methodologies: Analog and RF mixed signal design, Synthesis, DFT and test, Verification (simulation and formal), Design for manufacturability and yield, Power analysis and low-power design, Thermal analysis and temperature aware design, Physical design, packaging and board design, technology CAD, CMOS sensors and MEMS, nanoscale computing and nano-electronics, High performance computing, Multi-core and parallel architectures, Networks-on-chip.
Embedded Systems: Audio, Image and Video processing, Hardware/Software co-design and verification, reconfigurable systems, applications in DSP, communications, encryption, security, compression, hybrid systems-on-chip, embedded software tools, case studies, ESL design flows.
Theme based: Medical and automotive electronics, green electronics and computing, electronics for infrastructure systems, sensor networks, ambient intelligence, emerging markets and applications.
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SUBMISSION GUIDELINES:
All submissions are made online, through the conference web-site http://www.vlsiconference.com/. Detailed guidelines and updates are on this site.
Regular papers: The manuscript, to be prepared in IEEE two-column conference format and not to exceed six pages, must describe previously unpublished work, focusing on novel ideas, results and applications of the contribution. Submissions will undergo a double blind review process: Papers exceeding the page limit, or disclosing the identity of the authors will be rejected without review.
Embedded tutorials & Special Sessions: Proposals in emerging areas of relevance to this conference can be submitted as two-page extended abstracts with details of topics covered. Accepted proposals will require full regular papers to be submitted.
Panels: Proposals must be submitted with an abstract, together with names of panelists.
All submissions of papers and proposals will imply that, if selected, the same must be presented at the conference in person. Hence, approvals from parent organizations must be obtained before the submissions are made.
TUTORIALS:
Two days will be dedicated to full and half-day tutorials on important and emerging topics. Coordinating presenters are encouraged to submit proposals in the specified format giving adequate information on topics covered and details of other presenters.
EXHIBITS:
The conference provides a unique opportunity for vendors of VLSI design tools and services to display their products and services. Please contact the Exhibits chair for details.
DESIGN CONTEST:
Please check the conference website or contact the Design Contest Chair for more .
FELLOWSHIPS:
A limited number of fellowships will be awarded, based on need and merit, to partially cover the expenses of attendees from India. Candidates with accepted submissions will be given preference. |
