Package-Level HBM Integration: Technology Trends, Challenges and Applications
Jennifer Wong, VP FPGA Design, Xilinx
With increasing numbers of connected devices, data centers need to be workload-optimized so they can rapidly adapt to changing throughput, latency, and power requirements from a wide range of virtualized on-demand software applications. Most silicon products today contain internal memory along with the ability to interface to external memories on the board. To meet insatiable bandwidth demands, memory technologies are rapidly changing from DRAM-based devices and interfaces to new interfaces, packages and device technologies. One such technology, HBM, brings together internal and external memory by incorporating high-capacity, high-bandwidth memory within the package.
Jennifer Wong XILINX VP FPGA Design, Package-Level HBM Integration: Technology Trends, Challenges and Applications Jennifer Wong is Vice President of FPGA Product Development at Xilinx, Inc., where she is responsible for design methodology, device signal / power integrity, package design and chip-level integration. Jennifer holds B.S.E.E. and M.S.E.E. degrees from University of California, Berkeley.